| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce a thickness of a modified layer and efficiently form the modified layer.SOLUTION: A substrate processing device processes a substrate so as to form a modified layer inside a crystalline substrate, and includes a laser light source 150, a laser light condensing part 160 which irradiates a laser light from the laser light source 150 to a surface of a substrate 10 and condenses a laser light to a predetermined depth from the surface of the substrate 10, a stage 110 which relatively moves the laser light condensing part 160 to the substrate 10 and positions. The laser light condensing part 160 includes an aberration correction part 170 which corrects aberration of the laser light to be irradiated. The aberration correction part 170 has a data table in which an aberration correction amount corresponding to the predetermined depth, to which the laser light condensing part 160 condenses the laser light, is written, refers to the data table, and corrects by the aberration correction amount corresponding to the predetermined depth.</p> |
