发明名称 |
DOUBLE-SIDED POLISHING DEVICE OF WORKPIECE |
摘要 |
PROBLEM TO BE SOLVED: To provide a double-sided polishing device of a workpiece which can measure a thickness of the workpiece in real-time, and can prevent contamination and scratches or the like on the workpiece.SOLUTION: A double-sided polishing device includes: a rotation surface plate having an upper surface plate 2 and a lower surface plate; a sun gear and an internal gear respectively arranged on a center part and an outer circumference part of the rotation surface plate; and a carrier plate having one or more holding holes for holding a workpiece W. Polishing pads 7 are respectively adhered to a lower surface of the upper surface plate 2 and an upper surface of the lower surface plate. The upper surface plate 2 or the lower surface plate has one or more holes 10 passing through from the upper surface to the lower surface. The polishing pad 7 adhered to the surface plate on a side with the hole 10 has a hole 11 in a position corresponding to the hole 10. The double-sided polishing device includes a workpiece thickness measuring instrument for measuring a thickness of the workpiece W during double-sided polishing through the hole 10 and the hole 11. A recessed part 13 for arranging a window member 14 is formed on a bottom part 2b of a side wall 2a of the upper surface plate 2 partitioned by the hole 10 or on a top part of a side wall of the lower surface plate partitioned by the hole 10. |
申请公布号 |
JP2015123545(A) |
申请公布日期 |
2015.07.06 |
申请号 |
JP20130270033 |
申请日期 |
2013.12.26 |
申请人 |
SUMCO CORP |
发明人 |
MIURA TOMONORI;MIKURIYA SHUNSUKE |
分类号 |
B24B49/04;B24B37/08;B24B49/12;H01L21/304 |
主分类号 |
B24B49/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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