发明名称 DOUBLE-SIDED POLISHING DEVICE OF WORKPIECE
摘要 PROBLEM TO BE SOLVED: To provide a double-sided polishing device of a workpiece which can measure a thickness of the workpiece in real-time, and can prevent contamination and scratches or the like on the workpiece.SOLUTION: A double-sided polishing device includes: a rotation surface plate having an upper surface plate 2 and a lower surface plate; a sun gear and an internal gear respectively arranged on a center part and an outer circumference part of the rotation surface plate; and a carrier plate having one or more holding holes for holding a workpiece W. Polishing pads 7 are respectively adhered to a lower surface of the upper surface plate 2 and an upper surface of the lower surface plate. The upper surface plate 2 or the lower surface plate has one or more holes 10 passing through from the upper surface to the lower surface. The polishing pad 7 adhered to the surface plate on a side with the hole 10 has a hole 11 in a position corresponding to the hole 10. The double-sided polishing device includes a workpiece thickness measuring instrument for measuring a thickness of the workpiece W during double-sided polishing through the hole 10 and the hole 11. A recessed part 13 for arranging a window member 14 is formed on a bottom part 2b of a side wall 2a of the upper surface plate 2 partitioned by the hole 10 or on a top part of a side wall of the lower surface plate partitioned by the hole 10.
申请公布号 JP2015123545(A) 申请公布日期 2015.07.06
申请号 JP20130270033 申请日期 2013.12.26
申请人 SUMCO CORP 发明人 MIURA TOMONORI;MIKURIYA SHUNSUKE
分类号 B24B49/04;B24B37/08;B24B49/12;H01L21/304 主分类号 B24B49/04
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