SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which can make it harder to cause failure in encapsulation of a semiconductor chip even when positional deviation occurs when an encapsulation sheet is arranged.SOLUTION: A semiconductor device manufacturing method comprises: a process A of preparing a laminate in which a semiconductor chip is fixed on a support medium; a process B of preparing an encapsulation sheet; a process C of arranging the encapsulation sheet on the semiconductor chip of the laminate; and a process D of embedding the semiconductor chip to the encapsulation sheet to form an encapsulated body in which the semiconductor chip is embedded in the encapsulation sheet. A ratio d2/d1 of a distance d1 between two farthest two points on an outer periphery of the support medium in planar view to a distance d2 between the farthest two points on an outer periphery of the encapsulation sheet in planar view is equal to or higher than 1.007.