发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition from which a pattern excellent in adhesiveness to a substrate and water resistance can be formed, a pattern forming method using the photosensitive resin composition, a black matrix formed by using a photosensitive resin composition comprising the above photosensitive resin composition and containing a light-shielding agent as a colorant, and a display device including the black matrix.SOLUTION: The photosensitive resin composition is obtained by compounding (D) a silane coupling agent having a specific structure in a photosensitive resin composition comprising (A) an alkali-soluble resin, (B) a photopolymerizable monomer, and (C) a photopolymerization initiator.
申请公布号 JP2015125190(A) 申请公布日期 2015.07.06
申请号 JP20130267975 申请日期 2013.12.25
申请人 TOKYO OHKA KOGYO CO LTD 发明人 ISHIKAWA TATSURO;KUROKO MAYUMI;SHIODA MASARU
分类号 G03F7/075;G02B5/20;G03F7/004 主分类号 G03F7/075
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