| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device which efficiently radiates heat generated from an electronic component while preventing size increase of a substrate.SOLUTION: A metal film 31 serving as a heat transmission part is formed on an inner peripheral surface of a through hole 30 and in areas around the through hole 30 on a front surface and a rear surface of an insulation layer 23. The metal film 31 is connected with the metal layer 24 and the metal film 31 is placed in contact with a housing 11. The structure allows heat generated by an electronic component 13 to be transmitted to the housing 11 through the insulation layer 23, the metal layer 24, and the metal film 31 and radiated from the housing 11. |
