| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit board with a base capable of suppressing a resistance value of a resistive element pattern formed on the circuit board from being changed by heat at solder reflow.SOLUTION: A circuit board 1-1 with a base comprises: a circuit board 10 having resistive element patterns 35 and 37 configured by printing resistive element paste; a synthetic resin base 50 integrally attached on one surface of the circuit board 10 by insert molding; and a terminal plate 80 electrically connected with a circuit pattern formed on the circuit board 10. The terminal plate 80 is soldered to the other member by solder reflow. A thermal shield layer 60 for preventing heat at solder reflow from being transferred to the resistive element patterns 35 and 37 is provided on the resistive element patterns 35 and 37. The thermal shield layer 60 is formed of the same synthetic resin as the base 50.</p> |
