| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to securely divide a wafer in a case where the wafer is divided having a modified layer as a starting point by applying external force after forming the modified layer in the wafer.SOLUTION: Adhesive tape 62 having a heat shrinkable base material is attached to a support frame 61, thereby closing an opening part formed in the center of the support frame 61. Also, a wafer 10 is attached to the adhesive tape 62 located over the opening part, thereby forming a work set 63. A laser beam is condensed into the wafer 10, thereby forming a modified layer 15 along dividing lines. The base material of the adhesive tape 62 is heat shrunk by the application of heat, thereby applying stress to the wafer 10. The work set 63 is cooled to solidify the base material. The adhesive tape 62 is expanded and the wafer 10 is divided having as a starting point the modified layer 15 formed along the dividing lines. Thus, the state of being stressed by the solidification of the base material is maintained, pre-break undergoes, and the wafer can securely be divided.</p> |
