| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can easily remove a resin burr without increasing the number of manufacturing processes.SOLUTION: A semiconductor device has a mold exterior region and a mold inner region, and a lead frame which is subjected to stamping is used. A lead terminal of the lead frame in the mold exterior region has a shear drop part 6 and a recess is processed in the shear drop part 6. A semiconductor element is mounted on a top face of the lead frame in the mold interior region and encapsulated by a mold resin. After the recess processing and the resin encapsulation, a resin burr occurring at the shear drop part 6 of the lead frame in the mold exterior region is removed.</p> |
