| 摘要 |
<p>The present invention relates to a semiconductor package capable of preventing a lead frame from being separated from a mold part in a manufacturing process. For this, the semiconductor package according to the present invention includes at least one electronic device, a lead frame which includes a plurality of leads which are electrically connected to the electronic device, a lead connection member which is combined with at least one lead, and the mold part which encapsulates the lead connection member and the electronic device.</p> |
