| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a microchannel device which can weld protrusions for joining two members with ultrasonic welding without unevenness in height over the full length.SOLUTION: A manufacturing method of a microchannel device 1 includes an ultrasonic welding process in which protrusions 17 are welded on the surface of a substrate member 11 by applying ultrasonic vibration to a substrate member 10 in a state where the apexes of the protrusions 17 in the substrate member 10 with the protrusions 17 corresponding to the edge of a channel 3 extending on the surface are pressed against the surface of the substrate member 11. A concave stopper part 18 for welding stop is provided on the surface on which the protrusions 17 of the substrate member 10 are formed. In the ultrasonic welding process, the ultrasonic vibrations are started with the amplitude of the ultrasonic vibration applied to the substrate member 10 as a first value, and the amplitude is changed to a second value lower than the first value after the elapse of predetermined time. |
