| 摘要 |
PROBLEM TO BE SOLVED: To efficiently execute connection between an electric component and a conductor pattern on a board, connection between conductor patterns on the same surface of the board, and furthermore, connection between conductor patterns formed in different layers of the board via a through hole, and selective increase of a film thickness of a wiring pattern on the board in few processes.SOLUTION: When an electric circuit board is manufactured by mounting an electric component 31, etc. on a wiring board 10 comprising a conductor pattern 12, and a resist film 15 opening at connection parts 12a, 12b, etc. of the conductor pattern, a first conductive resin paste film 20a for joining the connection part 12a with the electric component 31, a second same paste film 20b extended on the resist film 15, wiring and connecting between the connection parts 12a, 12b, and a third same paste film 20c for connecting the conductor patterns 12, 13, 14 with one another via a through hole 17, are continuously formed as the same layer by application of the same paste. A fourth same paste film 23 for increasing a film thickness of a wiring pattern 12M is also simultaneously formed. |
