| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a collective molding module capable of achieving miniaturization and inexpensive fabrication.SOLUTION: A mold positioning pin is insert-molded while being inserted into a through-hole 15 of a circuit board 10, thereby forming a communication hole 35 for communicating the through-hole 15 and the outside on both surfaces of a case part 30. A testing metal plating 45 of the circuit board 10 is applied to the inner wall of the through-hole 15 and the communication hole 35.</p> |
