| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a liquid ejection head suppressing corrosion of wiring caused by solvent, and further to provide a liquid ejection device.SOLUTION: A liquid ejection head ejecting liquid containing solvent comprises: a flexible substrate 212; and a rigid substrate 250 bonded to the flexible substrate 212. The flexible substrate 212 comprises: a base material 213; a wiring layer 214 provided on the base material 213; a plated layer 215 provided across a whole area on the wiring layer 214; and a protective layer 216 provided on the plated layer 215. The rigid substrate 250 is bonded to a part of the plated layer 215 where the protective layer 216 is not provided.</p> |
