发明名称 CUTTING DEVICE OF FILM, CUTTING METHOD OF RELEASE FILM, CUTTING METHOD OF THE FILM, RESIN SEALING DEVICE OF COMPONENT SEALED WITH RESIN, RESIN SEALING METHOD OF THE COMPONENT SEALED WITH RESIN, AND DEVICE OF MANUFACTURING RESIN SEALED MOLDING
摘要 <p>PROBLEM TO BE SOLVED: To provide a film cutting device which can efficiently manufacture a large-size circular release film.SOLUTION: A film cutting device includes a rotation member 3, a rotation arm 7, and a cutter 9. The rotation member 3 and the cutter 9 are respectively connected directly or indirectly to one end of the rotation arm 7 and the other end of the rotation arm 7. The cutter 9 stabs a predetermined position of the film by moving the cutter 9 to a film surface, and passes inside the rotation member 3, and the rotation member 3 rotates around a rotation axis approximately vertical to a film surface. Thereby, the cutter 9 stabbed on the film and the rotation arm 7 rotates to cut the film in a circular shape.</p>
申请公布号 JP2015123558(A) 申请公布日期 2015.07.06
申请号 JP20130270429 申请日期 2013.12.26
申请人 TOWA CORP 发明人 OWARI HIROKI;TAKADA JUNKO
分类号 B26D3/10;B29C39/18;B29C39/24;H01L21/56 主分类号 B26D3/10
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