| 摘要 |
PROBLEM TO BE SOLVED: To achieve a wiring board having high reliability.SOLUTION: A wiring board 1 comprises: a conductor 12 provided on an inner wall of a through hole 11c in a core substrate 11; a resin 13 provided inside the conductor 12; and a land 14, for example, provided on the conductor 12 and the resin 13. The wiring board 1 further comprises vias 22 which are provided on the land 14 and connected to a plurality of connection regions 22a of the land 14, respectively, each of which straddles the conductor 12 and the resin 13 in the through hole 11c. The land 14 is pressed by the vias 22 connected to the plurality of connection regions 22a thereby to inhibit thermal expansion of the resin 13 on the land 14 side and breaking of the land 14 caused by the thermal expansion. |
