| 摘要 |
PROBLEM TO BE SOLVED: To effectively suppress occurrence of cracks at a solder joint part with a ceramic electronic component in a printed wiring board on which the ceramic electronic component is mounted.SOLUTION: Disclosed is a printed wiring board with a multilayer structure which is equipped integrally with a laminate material on one surface or both surfaces of a core base material and in which a ceramic electronic component containing a ceramic material as a base material is mounted on the laminate material. A high elastic raw material having a low thermal expansion coefficient which is almost equal to or lower than the ceramic material of the ceramic electronic component is used for the core base material, and a raw material which is lower in elasticity and richer in flexibility than a general purpose rigid material is used for the laminate material. |
