发明名称 SUBSTRATE SUCKING AND CONVEYING MECHANISM
摘要 PROBLEM TO BE SOLVED: To solve a problem that as a conventional substrate sucking and conveying mechanism does not have a substrate positioning function, a complicated structure is needed to arrange the substrate positioning mechanism on a substrate receiving base, and a time for placing on the substrate receiving base and positioning is always required.SOLUTION: In a substrate sucking and conveying mechanism (11) for sucking and conveying a substrate, a plurality of contactless substrate sucking members (10) are arranged so that a flat surface formed by a sucking surface becomes an inclined surface in which one corner part of the substrate sucking and conveying mechanism (11) becomes a lowermost end and inclination by which a substrate moves to the lowermost end by its weight is made. A first positioning pin (8) and a second positioning pin (9) may be respectively arranged on two sides across the corner part on the lowermost end. Thereby, the substrate moves by its weight during conveyance (14), and can be automatically positioned by abutting on the first positioning pin (8) and the second positioning pin (9).
申请公布号 JP2015123571(A) 申请公布日期 2015.07.06
申请号 JP20130271952 申请日期 2013.12.27
申请人 VIA MECHANICS LTD 发明人 SAMPEI NAOKI
分类号 B25J15/06;B23K26/10;H01L21/677 主分类号 B25J15/06
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