| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a curable composition which, when a semiconductor apt to deteriorate by moisture and oxygen is encapsulated using a fill material containing a phenyl sulfide derivative as a binder resin, can be used as a dam material and enables a dam having excellent moisture-proofness to be formed.SOLUTION: There is provided the curable composition containing: 95 to 15 wt% of a compound (A) represented by the following formula (a); a polymerization initiator (B); and 3 to 83 wt% of at least one kind of a filler (C) selected from among silica, talc, and calcined kaolin. A cured material (thickness: 100μm, degree of cure: 50% or more) has a water vapor permeability (at 60°C and 90% RH) of 25 g/m24hrs atm or less.</p> |
