| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a dicing tape for integrated dicing and die-bonding tape which produces less burr in the dicing process, and capable of picking up a thin wafer with a low push-up height amount without requiring to apply an excessive stress in the die-bonding process.SOLUTION: In a dicing tape for integrated dicing and die-bonding tape, an adhesive layer contains a (meth)acryl resin (A) containing, as components, 0.3-1.5 mmol/ga of chain-polymerizable functional group having glass transition temperature of -40°C or less, and a hydroxyl value of 20-150 mgKOH/g, where acid value is not detected substantially, and the weight-average molecular weight is 300,000 or more, a photoinitiator (B) capable of generating an active species that can be chain-polymerized when irradiated with at least one kind selected from UV-ray, electron beam, and visible light, and a crosslinking agent (C) having more than one functional group capable of reacting with hydroxyl in one molecule.</p> |
