MANUFACTURING METHOD OF SMART-CARD AND THE SMART-CARD USING THE SAME

摘要

The present invention relates to a method for manufacturing a smart card and to a smart card manufactured using the same. The method for manufacturing a smart card according to an embodiment of the present invention is a method for manufacturing a smart card having a non-contact chip module mounted thereon, comprising the steps of: attaching a first buffering film to one surface of an inlay substrate having a penetration part formed thereon to envelop the penetration part; fixing a chip module to the penetration part of the inlay substrate at an opposite side having the first buffering film attached thereto to be in contact with the first buffering film; forming an antenna coil and an antenna on the other surface of the inlay substrate; attaching a second buffering film to envelop the dam part of the chip module; and forming a smart card inlay by stacking a thickness adjustment layer including a hole opener on the upper end of the inlay substrate and the chip module. Using the same, a smart card having improved durability and having operation stability ensured can be manufactured.