SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which can inhibit peeling of a resin part on an outer periphery of a metal plate.SOLUTION: A semiconductor device comprises: a metallic component 54 having a surface including a semiconductor element mounting region and a resin adhesion region 540a which extends from the semiconductor element mounting region to an outer peripheral edge; a semiconductor element mounted on the semiconductor element mounting region; a resin part 66 which extends to the outside than a lateral face of the metallic component 54 and adheres to the resin adhesion region 540a to integrally cover the semiconductor element and the metallic component 54; a primer layer 80 provided between the resin adhesion region 540a and the resin part 66; and separation inhibition means 100 for inhibiting separation between the metallic component 54 and the resin part 66 on an outer periphery of the resin adhesion region 540a, the separation being caused by moisture absorption of the resin part 66.