| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive resin composition which can improve its coating film strength and adherence.SOLUTION: A conductive resin composition comprises hydroxy group- and carboxyl group-containing resin, conductive powder, reactive diluent, photopolymerization initiator, and thermosetting component, wherein the total hydroxyl equivalent of the hydroxy group- and carboxyl group-containing resin is 300 or more and 3000 or less. |
