| 摘要 |
PROBLEM TO BE SOLVED: To provide a slice method in which a silicon wafer reduced in copper pollution and having high cleanness can be stably obtained using a wire saw.SOLUTION: Disclosed is a slice method in which, while the coolant is supplied to a wire wound around a plurality of wire guides and the wire is made to travel, a silicon ingot is cut off by being pressed to the wire using a wire saw, and a plurality of sliced wafers are obtained. Copper concentration in the coolant supplied to the wire is made to be 80 ppm or less. |
