| 摘要 |
PROBLEM TO BE SOLVED: To provide a sensor panel and manufacturing method of the sensor panel that make distortion of a coupling part of lead-out wiring materials invisible externally, and enable enhancement of coupling strength between the lead-out wiring material and a substrate.SOLUTION: A sensor panel includes: a transparent substrate; a transparent electrode layer that is arranged in the transparent substrate; a wiring layer that is arranged in a peripheral part of the transparent substrate, and is connected to the transparent electrode layer; a flexible lead-out wiring material that is connected to the wiring layer; and a transparent first cover layer covering the transparent layer and a non-transparent second cover layer covering the wiring layer. A base part drawn from the transparent substrate of the lead-out wiring material is embedded in at least one of the first cover layer and second cover layer, and a connection part of the lead-out wiring material and the transparent substrate, and the base part are covered by the second cover layer. |
