发明名称 LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To provide a laminated electronic component and manufacturing method thereof capable of reducing possibility of occurrence of delamination even when ceramic layers and internal electrode layers are laminated in multiple layers.SOLUTION: The laminated electronic component has an electronic component body 1 in which ceramic layers 5 and internal electrode layers 7 are laminated alternately. The ceramic layer 5 includes plural grooves 9 formed parallel to each other on a main face 5a thereof in an oblique direction, and the internal electrode layer 7 is overlapped with the ceramic layer 5 so that a part of the internal electrode layer 7 buries the grooves 9. A ceramic green sheet is formed using a roll member which has the surface formed with spiral concave grooves which contains ceramic slurry. The grooves 9 and the internal electrode layer 7 which is formed to bury the grooves act to prevent generation of a force in a direction causing the delamination.</p>
申请公布号 JP2015126008(A) 申请公布日期 2015.07.06
申请号 JP20130267391 申请日期 2013.12.25
申请人 KYOCERA CORP 发明人 KIMURA TETSUYA
分类号 H01G4/12;H01G4/232;H01G4/30 主分类号 H01G4/12
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