| 摘要 |
<p>Provided is a motor-driven compressor including a semiconductor device that comprises a compression mechanism, a motor, a housing, a wall, an electronic component, and a resin member. The motor drives the compression mechanism. The housing accepts the compression mechanism and the motor inside. The wall extends from an outer surface of the housing so as to surround a part thereof and have an opened end and cooperates with the outer surface of the housing to form a casing. The electronic component is accepted in the casing and includes a semiconductor module that includes a circuit board connected to the outer surface of the housing and a semiconductor element mounted on the circuit board. The resin member seals the entire electronic component in the casing.</p> |
