| 摘要 |
An imaging unit in a first embodiment of the present invention is an imaging unit provided with: an imaging chip having a first surface having pixels and a second surface which is a surface on the opposite side from the first surface and is provided with an output part that outputs an pixel signal read from the pixels; a transparent substrate disposed facing the first surface and having a wiring pattern; a mounting substrate disposed facing the second surface and supporting the imaging chip; and a relay part disposed on the mounting substrate and relaying the pixel signal output by the output part to the wiring pattern. An imaging device in a second embodiment of the present invention is provided with the imaging unit described above. The imaging unit in the second embodiment is provided with: an imaging chip having a light receiving surface and a mounting surface on the side opposite from the light receiving surface; a mounting substrate disposed facing the mounting surface of the imaging chip and having a wiring pattern connected with the imaging chip; a transparent substrate disposed facing the light receiving surface of the imaging chip; and a connecting part that connects the wiring pattern of the mounting substrate and the transparent substrate. |
