| 摘要 |
Provided is a substrate cleaning apparatus capable of fully cleaning the entire pen sponge, and preventing particles which were removed once from being re-attached to the pen sponge. The substrate cleaning apparatus comprises: a substrate maintaining part (41) to maintain and rotate a substrate (W); a sponge cleaning device (42) in contact with the surface of the substrate (W) while rotating in the circumference of a central shaft line; a cleaning member (60) arranged to be adjacent to the substrate (W) maintained in the substrate maintaining part (41); and a cleaning device moving mechanism (51) to allow the sponge cleaning device (42) to be in contact with the cleaning member (60). The cleaning member (60) includes a cleaning surface (61) in contact with the sponge cleaning device (42), and the central part (61a) of the cleaning surface (61) is located at a higher position than the outer part (61b) of the central part. |
