METHOD OF USING A VAPORIZING SPRAY SYSTEM TO PERFORM A TRIMMING PROCESS

摘要

A method of semiconductor device fabrication including placing a substrate having a first and second features disposed thereon in a vaporizing spray deposition system. An atomizing spray head of the vaporizing spray deposition system is used to deposit a conformal polymer layer on the first and second features. The first feature having the layer of the polymer disposed thereon and having a first width. A spray trim process is performed on the first and second features having the polymer layer disposed thereon using the atomizing spray head.

主权项

1. A method of semiconductor device fabrication, the method comprising:
placing a substrate having a first and second features disposed thereon in a vaporizing spray deposition system; using an atomizing spray head of the vaporizing spray deposition system, depositing a conformal polymer layer on the first and second features, wherein the first feature having the layer of the polymer disposed thereon has a first width; and applying a spray trim process to the first and second features having the polymer layer disposed thereon, wherein the spray trim process includes:
using the atomizing spray head to deposit a solution on the plurality of features having the layer of polymer, andwherein the solution removes a portion of the layer of the polymer forming a reduced polymer layer, thereby providing the first feature having the reduced polymer layer disposed thereon has a second width, less than the first width.