MULTILAYER ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

A multilayer electronic component in which when an internal coil is formed in a direction perpendicular with respect to a substrate mounting surface and external electrodes are only formed on one surface (a lower surface) of the chip element facing a substrate at the time of mounting the chip element, the one surface to which the internal coil is exposed and on which the external electrodes need to be formed may be easily distinguished, and a manufacturing method thereof.

主权项

1. A multilayer electronic component comprising:
a multilayer body including a plurality of insulating layers stacked in a stacking direction; an internal coil part including internal coil patterns disposed on the insulating layers and electrically connected to one another through vias, and first and second lead portions exposed to a same surface of the multilayer body, the same surface being perpendicular to the stacked layers of the multilayer body; first and second external electrodes disposed on the same surface of the multilayer body disposed to be perpendicular to the stacked layers of the multilayer body, and connected to the first and second lead portions of the internal coil part, respectively; and a marking pattern disposed on a surface of the multilayer body, the surface being parallel to the stacked layers of the multilayer body.