发明名称 COPPER-TITANIUM ALLOY FOR ELECTRONIC COMPONENT
摘要 The present invention controls the fluctuations of Ti concentration in a copper-titanium alloy from a perspective different from conventional perspectives, and thus improves the strength and bending workability of the alloy. A copper -titanium alloy which is for use in an electronic component and which contains 2.0 to 4.0mass% of Ti and contains, as the third element, 0 to 0.5mass% in total of at least one element selected from the group consisting of Fe, Co, Mg, Si, Ni, Cr, Zr, Mo, V, Nb, Mn, B and P with the balance being copper and unavoidable impurities, wherein: the coefficient of variation in a Ti concentration fluctuation curve is 0.2 to 0.8, said Ti concentration fluctuation curve being obtained by subjecting a <100> textured crystal grain present in a cross section parallel to the rolling direction to a line analysis by EDX for Ti concentration of the matrix of the crystal grain; and in the structure observation of a cross section parallel to the direction of rolling, the number of second-phase particles having sizes of 3μm or more is 35 or less per 10000μm2 of the visual field of observation.
申请公布号 WO2015098201(A1) 申请公布日期 2015.07.02
申请号 WO2014JP74126 申请日期 2014.09.11
申请人 JX NIPPON MINING & METALS CORPORATION 发明人 HORIE,HIROYASU
分类号 C22C9/00;C22F1/00;C22F1/08;H01B1/02;H01B5/02 主分类号 C22C9/00
代理机构 代理人
主权项
地址