摘要 |
The present invention controls the fluctuations of Ti concentration in a copper-titanium alloy from a perspective different from conventional perspectives, and thus improves the strength and bending workability of the alloy. A copper -titanium alloy which is for use in an electronic component and which contains 2.0 to 4.0mass% of Ti and contains, as the third element, 0 to 0.5mass% in total of at least one element selected from the group consisting of Fe, Co, Mg, Si, Ni, Cr, Zr, Mo, V, Nb, Mn, B and P with the balance being copper and unavoidable impurities, wherein: the coefficient of variation in a Ti concentration fluctuation curve is 0.2 to 0.8, said Ti concentration fluctuation curve being obtained by subjecting a <100> textured crystal grain present in a cross section parallel to the rolling direction to a line analysis by EDX for Ti concentration of the matrix of the crystal grain; and in the structure observation of a cross section parallel to the direction of rolling, the number of second-phase particles having sizes of 3μm or more is 35 or less per 10000μm2 of the visual field of observation. |