THERMOSETTING EPOXY RESIN COMPOSITION AND USE THEREOF

摘要

A thermosetting epoxy resin composition, comprising: (A) epoxy resin; (B) an activated ester curing agent; (C) polyphosphonate and/or a phosphonate-carbonate copolymer. Prepregs and copper clad laminates thereof made from the epoxy resin composition have excellent dielectric properties and moisture and heat resistance, with flame retardancy reaching grade UL94 V-0.