| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a device in which, when a sheet bundle is generated, a binding stress on a sheet is reduced, and movement of a sheet on which an adhesive is applied is decreased relatively, so that it is eliminated that the adhesive sticks to other than a sheet at a transportation path and a stack part, for precise application of an adhesive to a sheet and precision stacking of a next sheet which is then applied with the adhesive.SOLUTION: A sheet processing device includes a carrying-in route 41 for carrying in a sheet, and an escape route 47 which is branched from the carrying-in route 41 for allowing at least a part of sheets accumulated at a stacker part to escape in the direction opposite to the carrying-in direction. A bonding means 50 disposed at a position where the carrying-in route and the escape route join together, and at carrying of a next sheet into a stacker part 40, an application position of a preceding sheet on which an adhesive is applied is escaped to the escape route 47, and after that, the next sheet is moved to a bonding position to be applied with the adhesive, which procedures are sequentially repeated to generate a sheet bundle.</p> |
