MANUFACTURING METHOD OF PROBING DEVICE

摘要

A manufacturing method of a probing device is provided. The manufacturing method includes following steps. First, a plurality of space transformers is disposed on a reinforcing plate and the space transformer includes a plurality of first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings are formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.

主权项

1. A manufacturing method for a probing device comprising:
providing a reinforcing plate; disposing a plurality of space transformers on the reinforcing plate, wherein a plurality of first pads are disposed on a surface of each space transformer; fixing the space transformer on the reinforcing plate, for configuring the internal circuitry of the space transformer to be electrically connected to the internal circuitry of the reinforcing plate; forming a photoresist film on the space transformer, wherein the photoresist film comprises a plurality of openings and at least a portion of the first pad is disposed in the opening; forming a metal layer in each of the plurality of openings, wherein the metal layer is disposed on and is directly contacted with the plurality of first pads for forming a plurality of second pads; providing a printed circuit board and electrically connecting the internal circuitry of the reinforcing plate to the internal circuitry of the printed circuit board; and providing a probe head, the probe head comprising a plurality of probing areas, each probing area corresponding to one of the plurality of space transformers, each probing area comprising a plurality of probes, wherein the probe is electrically connected to the internal circuitry of the space transformer via the second pad.