Vacuum Device by Using Centrifugal Resources

摘要

A wafer holding vacuum for a wafer polishing system and the wafer suction device for CMP (Chemical Mechanical Polishing) by utilizing existing resources provided by the rotating polishing post is provided. The device introduces a channel configured in the wafer suction device. One end of the channel is exposed at downside of the holding block, and another end of the tube is exposed at lateral side of the holding block. By aforementioned configuration, the channel can suck gas and/or liquid between the wafer and the device, and can discharge them to the outer environment at the lateral side using centrifugal force naturally provided by the polishing post.

主权项

1. A method for discharging fluid during wafer chemical mechanical polishing, comprising:
providing a block; and a polishing post body which is under rotation for other existing purpose not intended for discharging fluid, wherein one end of at least one channel is exposed at a contact surface between said block and a wafer, whereby utilizing existing centrifugal force created by said rotating polishing post body to suck fluid between said block and said wafer, and another end of said at least one channel is exposed at lateral side of said block, whereby discharging said fluid.