VACUUM INSULATING GLASS (VIG) UNIT WITH METALLIC PERIPHERAL EDGE SEAL AND/OR METHODS OF MAKING THE SAME

摘要

Certain example embodiments relate to vacuum insulating glass units having edge seals based on solder alloys that, when reactively reflowed, wet metallic coatings pre-coated on the glass substrates' perimeters, and/or associated methods. The alloys may be based on materials that form a seal at temperatures that will not de-temper glass and/or decompose a laminate, and/or remain hermetic and lack porous structures in their bulks. Example alloys may be based on inter-metallics of Sn and one or more additional materials selected from post-transition metals or metalloids; Zintl anions (e.g., In, Bi, etc.) from Group 13, 14, 15 or 16; and transition metals (e.g., Cu, Ag, Ni, etc.); and excludes Pb. Thin film coatings in certain example embodiments work with the solder material to form robust and durable hermetic interfaces. Because low temperatures are used, certain example embodiments can use compliant and visco-elastic spacer technology based on lamellar structures and/or the like.

主权项

1. A method of making a vacuum insulating glass (VIG) unit, the method comprising:
forming nickel-inclusive thin film coatings around peripheral edges of first major surfaces of first and second substrates; placing a plurality of spacers on the first major surface of the first substrate; placing a solid solder pre-form alloy material over and contacting the nickel-inclusive thin film coating formed on the first major surface of the first substrate; bringing together the first and second substrates such that the first major surfaces thereof face one another to form a subassembly; forming an edge seal, in vacuo, by reactively reflowing the solid pre-form alloy material, such that nickel from the nickel-inclusive thin film coatings diffuses into the alloy material and vice versa; and following the formation of the edge seal, which then includes inter-metallic compounds, further evacuating a cavity formed between the first and second substrates in making the VIG unit, wherein the solid solder pre-form alloy material includes Sn and at least one other material selected from the group consisting of post-transition metals or metalloids; Zintl anions from group 13, 14, 15 or 16; and transition metals.