| 摘要 |
<p>Provided is a manufacturing method for a circuit board which can achieve finer pitch wiring, and which can cause an electrical connection by way of a hole portion provided on an insulating layer to be more reliable. A manufacturing method for a circuit board (10) includes steps of: (A) preparing a structure which is provided with an insulating layer (20), comprising a first main surface (20a) and a second main surface (20b) facing the first main surface, and molecular bonding layers (30) which are provided on only the first main surface or on both the first main surface and the second main surface; (B) forming metal layers (42) which bond with the molecular bonding layers; (C) performing laser irradiation so as to form a hole portion (26) extending through the metal layers, the molecular bonding layers, and the insulating layer; (D) performing desmearing processing on the hole portion; (E) forming conducting layers (44); and (F) forming wiring layers (40).</p> |
