ADDITIVES FOR ELECTROPLATING BATHS

摘要

PROBLEM TO BE SOLVED: To provide leveling agents for use in metal electroplating baths for manufacture of printed circuit boards (PCBs) that provide level copper deposits while bolstering the throwing power of the bath.SOLUTION: Compounds as leveling agents are reaction products of halogenated pyrimidine derivatives and nucleophilic linker units. The compounds are included in metal electroplating baths to provide good throwing power. The metal electroplating baths are used to plate copper, tin and alloys of these on PCBs and semiconductors and fill through-holes and vias.