RESIN COMPOSITION AND USES OF THE SAME

摘要

A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of not higher than 0.006 at 1 GHz, and the filler is selected from the following group: strontium titanate, calcium titanate, barium titanate, magnesium titanate, combinations thereof and the sintered material of any of the combinations. The filler is doped or not doped with one or more elements selected from silicon, cobalt, nickel, manganese, and rare earth elements. The average particle size (D50) of the filler ranges from about 2 μm to about 10 μm. The amount of the filler is about 10 parts by weight to about 600 parts by weight per 100 parts by weight of the thermosetting resin component.

主权项

1. A resin composition, comprising:
a thermosetting resin component, having a dissipation factor (Df) of not higher than 0.006 at 1 GHz; and a filler, selected from the group consisting of strontium titanate, calcium titanate, barium titanate, magnesium titanate, combinations thereof, and sintered material of any one of the combinations, wherein, the filler is doped or not doped with at least one of silicon (Si), cobalt (Co), nickel (Ni), manganese (Mn), and rare earth elements; the filler has an average particle size (D50) ranging from about 2 μm to about 10 μm and an unimodal particle size distribution; and the amount of the filler is about 10 parts by weight to about 600 parts by weight per 100 parts by weight of the thermosetting resin component.