| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polishing liquid composition for silicon wafers which enables the decrease in the surface roughness (haze) of a silicon wafer and the surface defect (LPD), and others.SOLUTION: A polishing liquid composition for silicon wafers comprises: silica particles; a nitrogen-containing basic compound; and copolymer including a constitutional unit I expressed by the formula (1) below and a constitutional unit II expressed by the formula (2). In the formula (2), n is an average additional mole number of ethylene oxy groups, which is a number of 2-100. In the copolymer, the mass proportion (Mass of the constitutional unit I/Mass of the constitutional unit II) of the constitutional unit I expressed by the formula (1) to the constitutional unit II expressed by the formula (2) is preferably 50/50 to 99/1. [Chem. 1]</p> |
