| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a hot melt adhesive which has excellent adhesiveness under a high temperature condition above 60°C and under a low temperature condition below -10°C, that is, has excellent high temperature adhesiveness and low temperature adhesiveness and has a short set time.SOLUTION: There is provided a hot melt adhesive which comprises an ethylene-α-olefin copolymer (A), a thermoplastic block copolymer (B) of a vinyl-based aromatic hydrocarbon and a conjugated diene compound, a tackifier resin (C) and a wax (D) having a number average molecular weight of 200 to 3000.</p> |
