| 发明名称 |
FUZZY LOGIC CONTROL OF THERMOELECTRIC COOLING IN A PROCESSOR |
| 摘要 |
In an embodiment, a processor includes a fuzzy thermoelectric cooling (TEC) controller to: obtain a current TEC level associated with the processor; obtain a current fan power level associated with the processor; fuzzify the current TEC level to obtain a first fuzzy fan level; fuzzify the current fan power level to obtain a second fuzzy fan level; determine a new TEC power level based at least in part on the first fuzzy fan level, the second fuzzy fan level, and a plurality of fuzzy rules; and provide the new TEC power level to a TEC device associated with the processor, where the TEC device is to transfer heat from the processor to a heat sink. Other embodiments are described and claimed. |
| 申请公布号 |
US2015185741(A1) |
申请公布日期 |
2015.07.02 |
| 申请号 |
US201414548361 |
申请日期 |
2014.11.20 |
| 申请人 |
Intel Corporation |
发明人 |
Rangarajan Thanunathan;Khanna Rahul;De La Guardia Gonzalez Rafael;Le Minh T. |
| 分类号 |
G05D23/19;G06N5/04;G05B15/02 |
主分类号 |
G05D23/19 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A processor comprising:
a fuzzy thermoelectric cooling (TEC) controller to:
obtain a current TEC level associated with the processor;obtain a current fan power level associated with the processor;fuzzify the current TEC level to obtain a first fuzzy fan level;fuzzify the current fan power level to obtain a second fuzzy fan level;determine a new TEC power level based at least in part on the first fuzzy fan level, the second fuzzy fan level, and a plurality of fuzzy rules; andprovide the new TEC power level to a TEC device associated with the processor, wherein the TEC device is to transfer heat from the processor to a heat sink. |
| 地址 |
Santa Clara CA US |
