发明名称 WIRING STRUCTURE OF ARRAY SUBSTRATE
摘要 A wiring structure of an array substrate relates to the technical field of liquid crystal display, wherein comprised are a red, green and blue line (21) used as a data line in a curing process, an odd and even number line (22) used as a scan line in the curing process, an array substrate common line (20), a color film substrate common line (23), and, correspondingly, a red, green and blue line curing pad (21-1), an odd and even number curing pad (22-1), an array substrate curing pad (20-1) and a color film substrate curing pad (23-1) that are connected to the red, green and blue line (21), the odd and even number line (22), the array substrate common line (20) and the color film substrate common line (23) respectively and are used for receiving a voltage. Through improvement on prior art, a number of curing buses is reduced, thus peripheral wiring of the array substrate is reduced, buffer space of design and layout is increased, and a risk that a poor process occurs is also reduced.
申请公布号 WO2015096261(A1) 申请公布日期 2015.07.02
申请号 WO2014CN71182 申请日期 2014.01.23
申请人 SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. 发明人 CHAI, LI
分类号 G02F1/133 主分类号 G02F1/133
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