发明名称 IN-VEHICLE ELECTRONIC MODULE
摘要 The present invention addresses the problem that the contact resistance of contact connection parts of connection terminals constituted by non-noble metals, when exposed to high temperature environments or repeated temperature cycles, increases due to formation of oxide films on contact interfaces, or to biting by powder produced by micro-sliding abrasion. The purpose of the present invention is to provide an in-vehicle electronic module which has connection reliability comparable to that of the prior art in the environment of the engine compartment, and with which lower cost is possible, due to a reduction in the number of parts and to fewer assembly steps. The electronic module comprises a mounted circuit board of electronic components installed on a circuit board, and a case member for housing the mounted circuit board and protecting the mounted circuit board from the surrounding environment; has a connection structure by which electrical continuity is achieved by projecting a portion of the circuit board to the outside through an opening in the case and inserting a board terminal into an outside female connector; and has a structure in which a portion of the case member forms a connector housing for isolating from the surrounding environment a space in which the female connector is installed and in which the board terminal is present, and an insulating resin member is integrally molded or joined to the circuit board in order to secure the circuit board to the case.
申请公布号 WO2015098352(A1) 申请公布日期 2015.07.02
申请号 WO2014JP80290 申请日期 2014.11.17
申请人 HITACHI AUTOMOTIVE SYSTEMS, LTD. 发明人 KAJIWARA RYOUICHI;KAMOSHIDA MASARU;ISHII TOSHIAKI
分类号 H01R13/03;H05K1/09;H05K1/11 主分类号 H01R13/03
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