CHEMICAL MECHANICAL POLISHING LIQUID AND APPLICATION METHOD THEREOF

摘要

The invention relates to the application of a chemical mechanical polishing liquid for silicon polishing. The polishing liquid contains abrasive particles and organic amine. The polishing liquid of present invention has a high silicon-removing speed, can improve the hydrophilic properties of silicon wafer surfaces, and has the advantages of reducing the adsorption of the abrasive particles, and lowering down the haze of the wafer.