ADHESIVE FILM, DICING/DIE-BONDING FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive film which makes possible to manufacture a semiconductor device having good appearance even after resin sealing with good yield; and an application thereof.SOLUTION: An adhesive film is a colored adhesive film for embedding a first semiconductor element fixed on a mount base and fixing a second semiconductor element different from the first semiconductor element to the mount base. The adhesive film preferably includes at least one of a dye and a pigment. Further, the adhesive film preferably has a melt viscosity of 50-3000 Pa s at 120°C.