发明名称 FOAM MOLDING
摘要 <p>PROBLEM TO BE SOLVED: To provide a foam molding having both high void ratio and excellent flexural property.SOLUTION: A foam molding 1 comprises a large number of polystyrene resin foam particles 2 fused to each other. The foam molding 1 has continuous gaps 3 connecting intervals between the foam particles 2. The foam particles 2 constituting the foam molding 1 have a surface melting layer 21 formed on the surface. The foam molding 1 has a connection part 22 for connecting the foam particles 2 to each other. The connection part 22 is made by fusing foam particles 2a and 2b adjacent to each other followed by extending surface melting layers 21a and 21b. A void ratio of the foam molding is 5-65 volume %.</p>
申请公布号 JP2015120859(A) 申请公布日期 2015.07.02
申请号 JP20130266925 申请日期 2013.12.25
申请人 JSP CORP 发明人 YAMAJI HIROYUKI;SUZUYAMA MASAHIRO
分类号 C08J9/236 主分类号 C08J9/236
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