| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for packaging electronic devices which reduces a risk of blow-outs of melted solder without requiring masking materials, lithography or steps of removing excess solder.SOLUTION: The method includes melting solder for a solder jet 160. The method additionally includes depositing melted solder drops 130a from the solder jet 160 in a pattern on a first substrate 105a of a first component of an electronic device. The pattern comprises a plurality of individual dots 130b of melted solder. The method also includes aligning a second substrate 107 of a second component of the electronic device with the pattern deposited on the first substrate of the electronic device. The method further includes re-melting the solder deposited in the pattern on the first substrate. The method additionally includes, while the solder is re-melting, compressing the first and second substrates. |
