| 发明名称 |
ELECTRONIC COMPONENT MODULE |
| 摘要 |
An electronic component module may include a substrate configured to have a cavity formed therein, and an electronic component embedded in the cavity while being attached to one surface of the heat radiating plate. The electronic component module may significantly decrease effects of element interference and electromagnetic wave interference between electronic components by forming a wiring pattern above a cavity. |
| 申请公布号 |
US2015187676(A1) |
申请公布日期 |
2015.07.02 |
| 申请号 |
US201414259090 |
申请日期 |
2014.04.22 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
WON Jun Goo;PARK Sung Hwan;HAN Myeong Woo;BAE Hyo Gun;KIM Youn Suk;KIM Ki Joong |
| 分类号 |
H01L23/367;H01L23/15;H01L23/31;H01L23/522 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component module, comprising:
a substrate including a cavity formed therein; a heat radiating plate disposed on an opening of the cavity; and an electronic component embedded in the cavity while being attached to one surface of the heat radiating plate. |
| 地址 |
Suwon-Si KR |
