| 发明名称 |
DIE BONDER AND A METHOD OF CLEANING A BOND COLLET |
| 摘要 |
A die bonder comprises a movable bond collet for holding an electronic device, and a platform which comprises a cleaning surface for cleaning the bond collet when the bond collet contacts the cleaning surface. The die bonder also comprises a cleaning agent supply, wherein the cleaning agent supply is operative to provide a cleaning agent to the cleaning surface to facilitate the cleaning of the bond collet. |
| 申请公布号 |
US2015187617(A1) |
申请公布日期 |
2015.07.02 |
| 申请号 |
US201414578695 |
申请日期 |
2014.12.22 |
| 申请人 |
LEUNG Mei Po;LEE Wing Yin;CHONG Chi Ming |
发明人 |
LEUNG Mei Po;LEE Wing Yin;CHONG Chi Ming |
| 分类号 |
H01L21/67 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A die bonder, comprising:
a movable bond collet for holding an electronic device; a platform comprising a cleaning surface for cleaning the bond collet when the bond collet contacts the cleaning surface; and a cleaning agent supply; wherein the cleaning agent supply is operative to provide a cleaning agent to the cleaning surface to facilitate the cleaning of the bond collet. |
| 地址 |
Kwai Chung HK |
